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Mattson's 2900 RTP systems are widely employed by chip manufacturers
worldwide. The 2900 is a robust workhorse based on the
production-proven 2800 RTP system, combining its reliability
and low cost of ownership with the latest advances in process
performance.
Mattson’s unique dual-side wafer heating
and a contact-less edge-guard ring that surrounds the wafer
on the wafer-level
provide the highest wafer yields and best process results.
This proprietary dual-wafer heating technology provides minimized
thermal stress and strain in the wafer, virtually no wafer
warpage and, most importantly, the reduction of pattern effects.
Our
RippleTM-based temperature measurement, with its emissivity
compensation feature, ensures highly accurate and repeatable
temperature measurement. The independent lamp control provides
excellent temperature uniformity across the wafer. The 2900
offers a wide range of process applications that meet the
stringent manufacturing requirements of devices down to 130
nm technology node.
The system’s very small footprint,
dual-arm robot for optimized wafer handling and improved chamber
throughput
offer unparalleled cost of ownership benefits. The 2900 is
available for 200 mm and 150 mm wafer sizes.
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