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Mattson Technology’s 3000 systems are single-wafer
rapid thermal processors for the high volume production of
the most advanced IC’s. Outstanding temperature uniformity
across the wafer and wafer-to-wafer, along with the lowest
cost of ownership, have made the 3000 RTP system the preferred
RTP system for critical applications. The 3000 RTP systems
ensure the best results on the wafer and the highest wafer
yields, as well as offering high productivity and the smallest
footprint.
Mattson's proprietary design, with its combination
of dual-side wafer heating and a contact-less edge-guard
ring on the wafer
level, enables the most wafer-friendly thermal treatment
possible in an RTP system. This dual-side wafer heating technology
also guarantees minimized pattern effects, which can lead
to a deterioration of the yield in competing systems with
wafer top-side heating only. Our RippleTM-based temperature
measurement system combines emissivity-compensated pyrometry
with the highest accuracy and robustness for repeatable results
on the wafer.
Mattson extended its RTP product portfolio to
include the 3000 Plus RTP systems, designed to meet chipmakers’ most
advanced process needs. The 3000 Plus’ applications
suite ranges from state-of-the-art cobalt silicide anneals
to the most demanding flash anneal processes for ultra-shallow
junction formation. Several leading chip manufacturers are
using the flash anneal capabilities of the 3000 Plus RTP
system in their leading-edge 90 nm production lines.
The 3000
RTP systems are available in 300 mm and 200 mm as well as
200/300mm bridge tool configurations.
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