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Leadership in the 300 mm and 90 nm Transitions
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A dramatic step in increasing manufacturing
yields and reducing costs is the industry’s migration
to 300 millimeter wafers. The larger the wafer, the more chips
can be processed on that wafer, allowing our customers to lower
their cost per chip. By 2005, 300 mm is expected to crossover
to become the dominant wafer size used in integrated circuit
manufacturing.
Mattson led the way in 300 mm Strip and RTP technologies, and
our tools are installed and production-qualified at over 70%
of all customers using 300 mm technology globally. In Strip,
we extended the processing capabilities of our advanced 300
mm Aspen III Highlands and are demonstrating its low-k copper
cleaning processing capabilities at customer sites around the
world.
Our customers are also working to provide improved capability
to their markets by reducing the size of the transistor and
other circuit devices on the chip in order to put more computing
functionality into each millimeter of silicon. The next technology
node to achieve smaller transistors is the 90 nm node, and
we are working with over 85% of companies adopting 90 nm.
Our
Aspen III Highlands low-k strip system and our 3000 Plus RTP
tool are both targeted directly at the 90 nm node.
These tools are globally installed at leading customer sites
running 90 nm processes and are producing the results specified
by our customers. We are also extending our tungsten halogen
lamp RTP technology down to the 65 nm node, which will provide
our customers a lower risk approach to advanced transistor
formation.
We intend to continue to advance our technology
offerings in the areas of 300 mm and sub-90 nm transistor formation
as the industry continues the migration towards these new
wafer and feature sizes.
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