| Mattson's new
Atmos™ is a dual-chamber, single-wafer 300 millimeter (mm)
RTP system for high-volume chip manufacturing through the
32 nanometer (nm) technology node. Designed to address the
industry’s transition to single-wafer processing for
applications currently predominantly run on furnaces, Atmos
enables a broad range of applications, including selective
oxidation and shallow-trench isolation.
Atmos’ state-of-the-art model-based temperature measurement
and control system allows precise control across the wafer
and repeatable results from wafer-to-wafer, enabling customers
to fabricate thin, uniform oxides. Featuring an integrated
pyrogenic water-vapor generator, Atmos enables a broad range
of concentrations of reactive species at lower thermal budgets,
resulting in higher processing flexibility for shallow-trench
isolation (STI) liner processes. The system also features
a dedicated edge grip and edge support end-effector for superior
backside particle performance and on-the-fly wafer alignment
for higher throughput. The system’s modular, dual-chamber
platform is designed for ease of use and maintenance and
high reliability, critical factors in 300 mm volume production
environments.
Atmos combines the high-productivity capabilities of Mattson’s
production-proven Helios as well as wet oxidation capabilities in order to provide processing flexibility and reliability
for the most advanced thermal oxidation applications, including
selective oxidation and shallow-trench isolation. Atmos incorporates several proprietary design
features, including dual-side wafer heating, which reduces
pattern-related temperature effects and enables high yields.
Offering optimum processing flexibility and performance on
a low-cost, production-proven platform, Atmos is a highly
efficient, reliable single-wafer thermal solution for 70
nm and below device production. |
