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Mattson Technology’s Helios® features an advanced model based temperature measurement and control system that provides the uniformity, repeatability and reliability required for achieving superior device performance for the most demanding 300 mm applications, targeting source drain anneals or other high temperature anneals.

Built on a modular, dual-chamber platform designed for ease of maintenance and high reliability, the Helios includes a dual-arm robot for increased throughput over (120 wafers per hour). The system also features a contactless guard ring that entirely surrounds the wafer to eliminate edge effects, thus providing zero slip line generation during normal processing.

The Helios’ excellent thermal processing performance and temperature control, high productivity and small footprint offers significant Cost of Ownership advantages, making it the ideal solution for chipmakers seeking a robust, cost effective RTP system to address the most demanding processing applications for sub-90nm device development and production.

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