MATTSON TECHNOLOGY TO SHIP 9 ASPEN III STRIP SYSTEMS TO UMC

Shipments Confirm Mattson's Dry Strip Market Leadership

FREMONT, Calif. -January 22, 2001- Mattson Technology (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced it has signed agreements with UMC, one of Taiwan's largest semiconductor foundries, to ship nine Aspen III 300 mm strip systems. The systems, to be installed at UMC's 300 mm Fab 12 in Hsinchu, Taiwan, are scheduled to begin shipping in March.

According to Mattson Technology CEO Brad Mattson, this order builds upon the company's dry strip market leadership position. "Having UMC, a top 20 customer, select the Aspen III 300 mm strip systems certainly strengthens our market leadership in the dry strip market. We now have more than 30 Aspen III systems at multiple companies in four countries," noted Mattson. "We have remained steadfast in extending the technological strengths of the Aspen platforms into the 300 mm market. The system provides superior process performance with the highest throughput of any stripping machine presently available on the market."

Mattson also stated that the company's partnership approach to providing customer service and support played a major role. "It's no secret that we've continually strengthened our global infrastructure, especially in Taiwan. Because of this, we've been able to work closely with all of the major players in this market to better analyze and anticipate manufacturing needs. Our customers clearly indicated the need for a comprehensive, all-inclusive warranty in support of installed processing equipment. Mattson has responded to this by providing the industry's only three-year warranty, which includes unlimited training and consumable costs," concluded Mattson.
Mattson Technology was an early developer of 300 mm processing technologies, and has already manufactured and installed more than thirty 300 mm compatible Aspen III systems in manufacturing and pilot lines around the world.

About the Aspen III Strip system

Mattson's Aspen III Strip system's high throughput multistation design, with advanced wafer handling systems, utilizes a patented ICP source capable of removing photoresist and residue from the wafers, thus reducing the need for additional wet steps. The Aspen Strip system achieves excellent results for a variety of applications, including high dose implant strip, via residue removal, post metal etch residue removal and surface cleaning for advanced silicide applications, as well as cleaning low k trenches or vias.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in "front-end" fabrication of integrated circuits. The company is a market leader in dry strip and RTP equipment, and its products combine advanced process technology on high-productivity platforms backed by industry-leading support. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, Calif., the company maintains sales and support centers throughout the United States, Europe and Asia. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.