FREMONT, Calif.- July 23, 2002 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that a major U.S. logic device manufacturer has selected its Aspen III Highlands low-k system after a comprehensive evaluation. The system was purchased and is in production use in the U.S. wafer manufacturer's facility for back end of line (BEOL) ultra low-k dielectric surface preparation.

Low-k films are critical for leading-edge device applications, enabling denser circuitry and higher computing speeds. During qualification, the U.S. logic manufacturer found that the Aspen III Highlands allowed for the achievement of exceptional ultra low-k film integration. Validating the company's confidence in the Highlands' production capability, the chipmaker has placed a follow on order for a 300 mm Highlands system. The system, which will be used for further 300 mm process development and volume production, is scheduled to be delivered in the fourth quarter of this year.

"Production-worthy ultra low-k technologies are crucial to our customers' most advanced circuit designs," said Bob MacKnight, president of the Thermal, Films and Etch division at Mattson Technology. "Our customers face multiple challenges as they integrate these new materials and applications into their devices. The Highlands has proven its ability to help customers meet these challenges, and its advanced capabilities allow customers to extend and develop their chip designs with deep sub-micron technologies, including the use of very advanced ultra low-k materials."

About the Aspen III Highlands

The Aspen III Highlands is an advanced 200/300 mm system designed for low-k cleaning and high-dose implant resist removal. Built on Mattson's production-proven Aspen III platform, the Highlands features a proprietary ICP technology for optimal uniformity and low damage. The system's modular design allows process modules to be added for greater production capacity and process flexibility. The Highlands' dual-wafer processing capability provides the industry's leading productivity-virtually twice the throughput of competitive low-k capable systems. The Highlands' ability to reduce operational steps simplifies integration and provides customers unparalleled CoO.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in "front-end" fabrication of integrated circuits. The company is a market leader in dry strip and RTP equipment, and its products combine advanced process technology on high-productivity platforms backed by industry-leading support. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, Calif., the company maintains sales and support centers throughout the United States, Europe and Asia. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.