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Press
Releases - 2003 |
MATTSON TECHNOLOGY WINS MULTIMILLION-DOLLAR
ORDERS FROM SAMSUNG
FREMONT, Calif. — March 26, 2003 — Mattson
Technology, Inc. (NASDAQ: MTSN), a leading
supplier of advanced process equipment
used to manufacture semiconductors, today
announced that it has received follow-on
orders for its RTP and CVD systems from
Samsung Electronics Co., Ltd., the world’s
largest DRAM supplier. The multiple systems,
some of which have already begun shipment
and are in production, will be installed
in Samsung’s DRAM production facilities
in Kiheung, Korea and will be used for
the volume production of memory devices.
“
We have a long-standing partnership
with Samsung and are pleased that Samsung
has again selected our RTP and CVD systems
for 300 mm DRAM and logic production,” said
Norman W. Jones, vice president of Global
Business Operations of Mattson Technology. “These
Samsung orders are the latest in a series
of wins for our industry-leading 3000 RTP
product line and expands our large installed
base of RTP systems in the Asia Pacific
region. These orders confirm Samsung’s
confidence in our technologies’ ability
to deliver superior productivity and process
solutions to meet its fab requirements
as it transitions to sub-130 nanometer
production.”
Mattson Technology’s
RTP portfolio includes the 2900 for 200
mm production
and the industry-leading 3000 series for
300 mm fabrication and advanced applications,
including ultra-shallow junction and silicide
formation. The latest release of the 3000
Plus extends the application range for
production of sub-100 nm generation devices.
Key features of the 3000 systems include
proprietary dual-sided wafer heating and
temperature measurement technology that
provides enhanced uniformity and yield.
The
Aspen III CVD is a fully automated plasma-enhanced
CVD deposition system that
addresses the needs of large volume manufacturing
where cost is a major consideration, such
as DRAM, as well as small volume production
of ASIC and logic devices. The Aspen III
CVD is used for a variety of leading-edge
process applications and is available in
200 and 300 mm configuration.
This press
release contains forward-looking statements regarding, among
other matters,
the Company's future development efforts.
Forward looking statements address matters
that are subject to a number of risks
and uncertainties that can cause actual
results to differ materially. In addition
to the general risks associated with
the slowdown in the semiconductor industry
and development of complex technology,
our future results will depend on a variety
of factors, including the timing of significant
orders, our ability to timely manufacture
and deliver ordered products, our ability
to bring new systems to market, the timing
of new product releases by our competitors,
our ability to reduce cost in response
to market conditions, and other competitive
factors. Reference is made to the Company's
filings with the Securities and Exchange
Commission for further discussion of
risks and uncertainties regarding the
Company's business. The Company assumes
no obligation to update the information
in this press release.
About Mattson Technology, Inc.
Mattson
Technology, Inc. is a leading supplier
of semiconductor wafer processing equipment
used in "front-end" fabrication
of integrated circuits. The company is a market leader in
dry strip and RTP equipment, and its products combine advanced
process technology on high-productivity platforms backed
by industry-leading support. Since beginning operations in
1989, the company’s core vision has been to help bring
technology leadership and productivity gains to semiconductor
manufacturers worldwide. Headquartered in Fremont, Calif.,
the company maintains sales and support centers throughout
the United States, Europe and Asia. For more information,
please contact Mattson Technology, Inc., 47131 Bayside Parkway,
Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900.
Fax: (510) 492-5911. Internet: www.mattson.com.
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