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Press
Releases - 2003 |
MATTSON
TECHNOLOGY SECURES FOLLOW-ON 300 MM ORDERS FROM MAJOR EUROPEAN
CHIPMAKER
RTP & Strip Systems Selected for Superior
Process Performance
FREMONT, Calif. — May 6, 2003 — Mattson
Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced
process
equipment used to manufacture semiconductors, has won follow-on
orders from a major European-based semiconductor manufacturer
for multiple 300 mm RTP and strip processing equipment. These
multimillion-dollar follow-on orders mark the latest in a
string of orders from the European chipmaker, a long-standing
customer that already has a suite of Mattson products installed
at its production facilities around the world. The first
of the tools, a 300 mm Aspen III Strip system, has been shipped
to the customer's 300 mm wafer fab. Additional Aspen III
Strip and 3000 Steam RTP systems are planned to ship in the
second half of 2003.
“ Our customer continues to choose Mattson products
to extend its fab capacity because our systems deliver superior
process capabilities, high throughput and low cost of ownership,” Michael
Fink, European country manager of Mattson Technology. “These
latest orders reaffirm Mattson's leadership position in RTP
and strip and strengthen that lead in the 300 mm arena. We
value our close relationship with this long-time customer
and are pleased to be able to continue to provide a competitive
advantage in 300 mm processing while supporting its sub-90
nanometer production needs."
Mattson’s Aspen III
ICP Strip is an advanced 300 mm strip system for residue
and resist removal. The tool features
a modular design with an advanced wafer-handling system and
uses a patented ICP source for low ionization to minimize
charge and provide highly selective etch rates.
The 3000 series,
available in both 300 mm and 200 mm models, is Mattson Technology’s
industry-leading RTP product line. The 3000 series RTP product
line includes the production-proven
3000, the 3000 Steam for wet oxidation applications and the
3000 Plus for high volume production of devices with 90 nm
technology and below design rules. The versatile 3000 series
offers a complete applications portfolio, including ultra-shallow
junction formation, silicidation, S/D annealing, dry and
steam oxidation, including oxynitrides, glass reflow and
substrate wafer processing.
About Mattson Technology, Inc.
Mattson
Technology, Inc. is a leading supplier of semiconductor wafer
processing equipment used in "front-end" fabrication
of integrated circuits. The company is a market leader in
dry strip and RTP equipment, and its products combine advanced
process technology on high-productivity platforms backed
by industry-leading support. Since beginning operations in
1989, the company’s core vision has been to help bring
technology leadership and productivity gains to semiconductor
manufacturers worldwide. Headquartered in Fremont, Calif.,
the company maintains sales and support centers throughout
the United States, Europe and Asia. For more information,
please contact Mattson Technology, Inc., 47131 Bayside Parkway,
Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900.
Fax: (510) 492-5911. Internet: www.mattson.com.
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