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News
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Press Releases - 2003 |
MAJOR
TAIWANESE FOUNDRY PLACES ADDITIONAL ORDERS FOR MATTSON TECHNOLOGY’S
300 MM ASPEN III HIGHLANDS AND STRIP SYSTEMS
Systems to be Used for FEOL and BEOL Processing for Foundry’s
300 mm Fab Ramp
FREMONT, Calif. — July 15, 2003 — Mattson Technology,
Inc. (NASDAQ: MTSN), a leading supplier of advanced process
equipment used to manufacture semiconductors, today announced
that it has received a follow-on order for 300 mm Aspen III
Highlands and Aspen III Strip systems from a major Taiwanese
foundry. The systems will be used for front-end-of-line (FEOL)
and back-end-of-line (BEOL) advanced low-k /copper cleaning
applications in the foundry’s 300 mm production facilities.
System deliveries are expected to begin shipment by the end
of July 2003.
“
Our Aspen Strip systems are widely used throughout
this foundry’s 200 mm and 300 mm fabs, where they play
a key part in manufacturing of its most advanced chips,” said
Bruno Doetsch, senior director of Asian (China, Taiwan, Southeast
Asia) operations of Mattson Technology. “We have worked
closely with our customer to qualify the Aspen III Highlands
for high-volume foundry production, and the system’s
low-k/copper processing capabilities and high productivity
were important factors in the selection of the tools. This
repeat order is an acknowledgement of our strip technology
leadership in both FEOL and BEOL platforms from one of the
world’s recognized foundry leaders. We are pleased
to continue our strong relationship with this customer by
providing advanced strip systems that will help accelerate
the ramp of its 300 mm manufacturing.”
About the Aspen III Highlands
The Aspen III Highlands is an advanced 300 mm system used
for removing resist, residue and barrier layer for low-k/copper
applications. Built on Mattson's production-proven, high-throughput
Aspen III platform, the Highlands features a proprietary
ICP technology for optimal uniformity and low damage. The
system's modular design allows process modules to be added
for greater production capacity and process flexibility.
The Highlands' dual-wafer processing capability provides
the industry's leading productivity—virtually twice
the throughput of competitive low-k capable systems. The
Highlands' ability to reduce operational steps simplifies
integration and provides customers unparalleled total cost
of ownership (TCO).
About the Aspen III Strip
The Aspen III Strip system features Mattson Technology’s
proprietary inductively coupled plasma (ICP) source that
effectively strips the resist and residue, reducing the need
for post-strip chemical processing. The system achieves excellent
results for high-dose implant strip, residue removal and
surface cleaning for advanced applications, including low-k
and, oxygen and non-oxygen-based processes. The Aspen III
Strip system offers advanced technology on a high-throughput
platform, providing process performance and low cost of ownership
advantages to chipmakers for advanced device manufacturing.
About Mattson Technology, Inc.
Mattson Technology,
Inc. is a leading supplier of semiconductor wafer processing
equipment used in "front-end" fabrication
of integrated circuits. The company is a market leader in
dry strip and RTP equipment, and its products combine advanced
process technology on high-productivity platforms backed
by industry-leading support. Since beginning operations in
1989, the company’s core vision has been to help bring
technology leadership and productivity gains to semiconductor
manufacturers worldwide. Headquartered in Fremont, Calif.,
the company maintains sales and support centers throughout
the United States, Europe and Asia. For more information,
please contact Mattson Technology, Inc., 47131 Bayside Parkway,
Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900.
Fax: (510) 492-5911. Internet: www.mattson.com.
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