TOWER
SEMICONDUCTOR SELECTS MATTSON TECHNOLOGY’S STRIP SYSTEMS
FOR FAB 2
FREMONT, Calif. — July 28, 2003 — Mattson
Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced
process equipment used to manufacture semiconductors, today
announced it has received follow-on orders for multiple Aspen
ICP Strip systems from Tower Semiconductor Ltd. The systems
are scheduled to begin shipment in the third quarter of 2003
and
will be installed in Tower’s 0.18 micron Fab 2 foundry.
“Tower Semiconductor is focused on world-class, cost
effective manufacturing,” said Erez Taoz, Tower Semiconductor’s
vice president - Fab 2 manager. “The Aspen ICP Strip
system was chosen for its high productivity, throughput and
low
cost of ownership. Mattson’s process expertise and
strong customer support were also key considerations in our
decision.”
“Tower Semiconductor and Mattson Technology share
a commitment to provide technologies that support our customer’s
current and future requirements,” said Michael Fink,
European operations director and country manager of Mattson
Technology. “Our dry strip solutions have been chosen
by most of the world’s leading foundries, and this
recent order from Tower further confirms the leadership and
global acceptance of our strip technology. We are pleased
to continue our close relationship with Tower and to support
its programs as it ramps production in the Fab 2 facility.”
About the Aspen ICP Strip
The Aspen ICP Strip system features Mattson Technology’s proprietary
inductively coupled plasma (ICP) source for low-damage processing. The system
effectively strips resist and residue, reducing the need for post-strip chemical
processing. The Aspen ICP Strip system offers advanced technology on a high-throughput
platform, providing process performance and low cost of ownership advantages
to chipmakers for advanced device manufacturing.
About Tower Semiconductor
Tower Semiconductor Ltd. is a pure-play independent
wafer foundry established in 1993. The company manufactures
integrated circuits with geometries ranging from 1.0 to 0.18
microns; it also provides complementary manufacturing services
and design support. In addition to digital CMOS process technology,
Tower offers advanced non-volatile memory solutions, mixed-signal
and CMOS image-sensor technologies. To provide world- class
customer service, the company maintains two manufacturing
facilities: Fab 1 has process technologies from 1.0 to 0.35
microns and can produce up to 20,000 150-mm wafers per month.
Fab 2 features 0.18-micron and below process technologies,
including foundry-standard technology, and will offer full
production capacity of 33,000 200-mm wafers per month. The
Tower Web site is located at http://www.towersemi.com
About Mattson Technology, Inc.
Mattson Technology,
Inc. is a leading supplier of semiconductor wafer processing
equipment used in "front-end" fabrication
of integrated circuits. The company is a market leader in
dry strip and RTP equipment, and its products combine advanced
process technology on high-productivity platforms backed
by industry-leading support. Since beginning operations in
1989, the company’s core vision has been to help bring
technology leadership and productivity gains to semiconductor
manufacturers worldwide. Headquartered in Fremont, Calif.,
the company maintains sales and support centers throughout
the United States, Europe and Asia. For more information,
please contact Mattson Technology, Inc., 47131 Bayside Parkway,
Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900.
Fax: (510) 492-5911. Internet: www.mattson.com.
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