MATTSON TECHNOLOGY SECURES FOLLOW-ON 300 MM STRIP ORDERS FROM LEADING TAIWAN FOUNDRY

Multiple-System Orders Affirm Market and Technology Leadership of Aspen Platform

FREMONT, Calif. — November 10, 2003 — Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has received multi-million dollar follow-on orders from a major Taiwanese foundry for several 300 mm Aspen III ICP Strip and Aspen III Highlands systems. These mark the latest in a string of orders for Mattson Technology's advanced processing systems in Taiwan. The 300 mm strip systems, some of which have already been shipped, will be used for front-end-of-line (FEOL) and back-end-of-line (BEOL) advanced low-k/copper cleaning applications for 130 nm and 90 nm production of DRAM and logic devices.

"Our customer again selected our leading-edge strip systems because they deliver the high productivity and excellent performance required for its competitive foundry manufacturing business,” said Bruno Doetsch, senior director and general manager of Asian operations of Mattson Technology. “We are pleased that our 300 mm strip tools continue to meet our customer’s needs for exceptional reliability, quality and productivity and look forward to providing the advanced systems and technologies that will help it address the demanding requirements of FEOL bulk stripping and BEOL low-k/copper cleaning production."

About the Aspen III Highlands & the Aspen III Strip

Mattson Technology’s Aspen III ICP Strip and Aspen III Highlands have been adopted by 300 mm fab lines worldwide and share an outstanding reputation as high-productivity platforms with superior cost-of-ownership benefits. Both the Aspen III ICP Strip and the Aspen III Highlands feature Mattson’s proprietary inductively coupled plasma (ICP) source technology for optimal uniformity and are designed to meet the rigors of high-volume manufacturing in the 300 mm wafer/100 nm and below device era. The Aspen III Highlands is an advanced 300 mm system used for removing resist, residue and barrier layer for low-k/copper applications. The Aspen III ICP Strip system achieves excellent results for high-dose implant strip, photoresist and residue removal and surface cleaning for advanced applications, including low-k and oxygen and non-oxygen-based processes. Both systems provide customers excellent process performance and total cost of ownership (TCO) advantages for advanced device manufacturing.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in "front-end" fabrication of integrated circuits. The company is a market leader in dry strip and RTP equipment, and its products combine advanced process technology on high-productivity platforms backed by industry-leading support. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, Calif., the company maintains sales and support centers throughout the United States, Europe and Asia. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.