ELPIDA MEMORY SELECTS MATTSON TECHNOLOGY’S RTP SYSTEMS FOR SUB-100 NM DEVICE DEVELOPMENT

FREMONT, Calif. and TOKYO, Japan— December 9, 2003 — Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has installed additional 3000 RTP systems at Elpida Memory’s 300 mm fab in Hiroshima, Japan, where they join several Mattson RTP systems already in production. The systems will be used for next-generation device production and development of 110 nm and below RTP applications.

"Mattson Technology’s RTP technology enables Elpida to accelerate the manufacturing of our latest-generation DRAM chips, which in turn ultimately reduces our customers’ time to market of these products,” said Dr. Shuichi Otsuka, chief operations officer of Elpida Memory, Inc. “Our growing installed base of Mattson RTP systems provide leading-edge RTP technology, high productivity performance and cost of ownership advantages, which are extremely important in today’s competitive environment.”

“As chipmakers implement 100 nm generation devices and are actively developing next-generation sub-90 nm production processes, they are realizing the benefits of our dual-side heating RTP technology,” said Juergen Biangardi, general manager of thermal products division of Mattson Technology. “Our customer’s repeat orders shows a high level of confidence in the capability and performance of our RTP tools, which offer the technical and productivity advantages required for the most demanding RTP applications.”

“Elpida is a leader in DRAM technology, supplying major chipmakers around the world,” said Mike Morita, Mattson Technology’s vice president of U.S., Europe and Japan operations. “Its selection of our 3000 series RTP systems for advanced DRAM manufacturing further demonstrates Mattson Technology’s continued momentum in RTP technology leadership. We are pleased that Elpida continues to choose our RTP systems for their current and future DRAM production requirements.”

About the 3000 RTP Series

The 3000 series is Mattson Technology's advanced RTP product line. The 3000 series tools leverage Mattson Technology’s unique spike anneal and oxidation process capabilities, in conjunction with the standard suite of RTP applications, to provide chipmakers the superior thermal processing performance needed for their stringent next-generation manufacturing requirements at the 90 nm technology nodes.

About Elpida Memory, Inc.

Elpida Memory, Inc. is a manufacturer of Dynamic Random Access Memory (DRAM) with headquarters based in Tokyo, Japan, and sales and marketing operations located in Japan, North America, Europe and Asia. Elpida offers a broad range of leading-edge DRAM products. Elpida is a joint venture company formed by NEC and Hitachi on December 20, 1999.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in "front-end" fabrication of integrated circuits. The company is a market leader in dry strip and RTP equipment, and its products combine advanced process technology on high-productivity platforms backed by industry-leading support. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, Calif., the company maintains sales and support centers throughout the United States, Europe and Asia. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.