MATTSON TECHNOLOGY STRENGTHENING MOMENTUM IN RTP AND STRIP IN JAPANESE MARKET

Major Japanese Chipmakers Purchase Systems for BEOL and FEOL 300 mm Production

FREMONT, Calif.- March 2, 2004 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that two leading Japanese semiconductor manufacturers have selected its RTP and photoresist dry strip systems for volume production in their state-of-the art 300 mm fabs. The purchases, which include Mattson’s next-generation RTP tool, the Aspen III ICP and the Aspen III Highlands strip systems, represent the chipmakers’ first orders for 300 mm Mattson tools and expand their existing suite of Mattson’s RTP and resist removal technologies. The RTP and strip systems, which began shipment in the fourth quarter of 2003, will be used for low-temperature silicidation and spike anneal RTP applications and FEOL (front-end-of-line) bulk strip and BEOL (back-end-of-line) low-k strip applications in 90 and 65 nm on 300 mm production.

“Our advanced RTP and strip systems were selected because they deliver the robust production and process capabilities necessary for 300 mm manufacturing of leading-edge devices,” said Andreas Toennis, Mattson Technology’s vice president of Technology Applications & Support. “These latest strategic design wins in Japan, forecasted to be one of the strongest regions in 2004, reinforce Mattson’s technological leadership in the 300 mm market across both front- and back-end-of-line wafer processing down to the 65 nm technology node. We are pleased to continue supporting our long-standing customers as the Japanese market strengthens by providing the technology and process extendibility they require to move toward sub-90 nm device production.”

Mattson’s 300 mm strip and RTP products provide next-generation features built on a foundation of existing, production-proven 200 mm technology. Both the Aspen III ICP Strip and the Aspen III Highlands feature Mattson’s proprietary inductively coupled plasma (ICP) source technology for optimal uniformity. The Aspen III Highlands is an advanced 300 mm system used for removing resist, residue and barrier layer for low-k/copper applications. The Aspen III ICP Strip system achieves excellent results for high-dose implant strip, photoresist and residue removal and surface cleaning for advanced applications, including low-k and oxygen and non-oxygen-based processes.

Mattson’s next-generation RTP tool combines a proprietary dual-side heating technology with an advanced temperature control system to deliver exceptional within-wafer uniformity and wafer-to-wafer repeatability. The system leverages Mattson Technology’s unique spike and low-temperature annealing capabilities, in conjunction with the standard suite of RTP applications, to provide chipmakers the thermal processing performance needed for their stringent next-generation manufacturing requirements at the 90 and 65 nm technology nodes.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company’s dry strip and RTP equipment utilize innovative technology to deliver advanced processing capabilities on high-productivity platforms for the fabrication of current- and next-generation devices. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.