TECHNOLOGY WINS 300 MM RTP SYSTEM ORDERS FROM MAJOR JAPANESE LOGIC CHIPMAKER
FREMONT, Calif.- July 6, 2004 - Mattson
Technology, Inc. (NASDAQ: MTSN), a
leading supplier of advanced process
used to manufacture semiconductors,
today announced a major competitive win for its 300 mm RTP
systems at one of Japan’s largest chipmakers. Following
a head-to-head competitive evaluation, Mattson’s advanced
RTP tools were selected for this manufacturer’s logic
300 mm fab in northern Japan. The systems, which have been
recently shipped, are the first Mattson 300 mm RTP tools
ordered by this customer.
Mattson’s RTP systems demonstrated excellent yield
for 90 nm low-temperature processing and have been qualified
for 65 nm low-temperature nickel silicide (NiSi) processing.
The equipment will be used to manufacture system chips used
in automobiles and digital consumer electronics such as DVD
recorders, cell phones and digital cameras.
“As one of the world’s ten largest chipmakers,
our customer is aggressively seeking RTP equipment that provides
the high productivity and superior process performance required
to meet the device challenges of its most critical applications,” said
Andreas Toennis, vice president and general manager of the
Thermal Products Group for Mattson Technology. “After
a thorough evaluation, the customer chose our 300 mm RTP
systems for their excellence in throughput, temperature profile
control and process performance, particularly for advanced
applications such as critical soak anneals and low-temperature
silicidation. This leading logic chipmaker’s selection
of our most advanced RTP tools underscores its confidence
in our technologies’ capabilities to meet the 90 nanometer
volume production requirements today, as well as address
the process development challenges through the 65 nanometer
technology node. This new account win further validates Mattson’s
strengthening position in the RTP marketplace.”
About Mattson RTP Products
Mattson Technology's advanced RTP product line includes
the 3000, the 3000 Steam, the 3000 Plus and an advanced new
RTP tool for 65 nm production. The systems’ high productivity
and small footprint offer significant cost-of-ownership advantages.
These advanced RTP tools provide the excellent thermal processing
performance needed to address the challenges of the most
demanding RTP applications, including USJ and NiSi formation,
and the stringent manufacturing requirements at the 90 nm
technology node and beyond.
Mattson Technology, Inc.
Mattson Technology, Inc. is a
leading supplier of semiconductor wafer
processing equipment used in the fabrication
of integrated circuits. The company’s
dry strip and RTP equipment utilize innovative
technology to deliver advanced processing
capabilities on high-productivity platforms
for the fabrication of current- and next-generation
devices. Since beginning operations in
1989, the company’s core vision has
been to help bring technology leadership
and productivity gains to semiconductor
manufacturers worldwide. For more information,
please contact Mattson Technology, Inc.,
47131 Bayside Parkway, Fremont, Calif.
94538. Telephone: (800) MATTSON/(510) 657-5900.
Fax: (510) 492-5911. Internet: www.mattson.com.