MATTSON TECHNOLOGY WINS 300 MM RTP SYSTEM ORDERS FROM MAJOR JAPANESE LOGIC CHIPMAKER

FREMONT, Calif.- July 6, 2004 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced a major competitive win for its 300 mm RTP systems at one of Japan’s largest chipmakers. Following a head-to-head competitive evaluation, Mattson’s advanced RTP tools were selected for this manufacturer’s logic 300 mm fab in northern Japan. The systems, which have been recently shipped, are the first Mattson 300 mm RTP tools ordered by this customer.

Mattson’s RTP systems demonstrated excellent yield for 90 nm low-temperature processing and have been qualified for 65 nm low-temperature nickel silicide (NiSi) processing. The equipment will be used to manufacture system chips used in automobiles and digital consumer electronics such as DVD recorders, cell phones and digital cameras.

“As one of the world’s ten largest chipmakers, our customer is aggressively seeking RTP equipment that provides the high productivity and superior process performance required to meet the device challenges of its most critical applications,” said Andreas Toennis, vice president and general manager of the Thermal Products Group for Mattson Technology. “After a thorough evaluation, the customer chose our 300 mm RTP systems for their excellence in throughput, temperature profile control and process performance, particularly for advanced applications such as critical soak anneals and low-temperature silicidation. This leading logic chipmaker’s selection of our most advanced RTP tools underscores its confidence in our technologies’ capabilities to meet the 90 nanometer volume production requirements today, as well as address the process development challenges through the 65 nanometer technology node. This new account win further validates Mattson’s strengthening position in the RTP marketplace.”

About Mattson RTP Products

Mattson Technology's advanced RTP product line includes the 3000, the 3000 Steam, the 3000 Plus and an advanced new RTP tool for 65 nm production. The systems’ high productivity and small footprint offer significant cost-of-ownership advantages. These advanced RTP tools provide the excellent thermal processing performance needed to address the challenges of the most demanding RTP applications, including USJ and NiSi formation, and the stringent manufacturing requirements at the 90 nm technology node and beyond.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company’s dry strip and RTP equipment utilize innovative technology to deliver advanced processing capabilities on high-productivity platforms for the fabrication of current- and next-generation devices. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.