MATTSON TECHNOLOGY WINS MULTI-PRODUCT ORDERS FROM HYNIX SEMICONDUCTOR FOR DRAM PRODUCTION IN NEW 300 MM FAB

FREMONT, Calif.- July 14, 2004 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has won multi-product system orders from Hynix Semiconductor Inc., one of the world’s leading manufacturers of memory chips, for the production of dynamic random access memory (DRAM) devices in its new T1 300 millimeter (mm) wafer fabrication plant in Ichon, South Korea. Mattson’s new Helios rapid thermal processing (RTP) and multiple Aspen III plasma tools, including the Aspen III ICPHT Strip system, are expected to be installed in Hynix’ new fab for its 300 mm pilot line by the end of August 2004.

“Hynix selected Mattson Technology’s suite of systems for its new 300 mm fab because they exhibited the best overall performance results in our customer’s stringent equipment evaluation,” said Juergen H. Biangardi, vice-president and general manager of the Thermal Products Group for Mattson Technology. “Mattson’s thermal and plasma tools delivered superior technology, excellent reliability and high throughput, thus providing both the technical and economic advantages that will enable Hynix to accelerate the manufacturing and time-to-market of its latest generation of DRAM chips.”

“After a rigorous evaluation of competitive tools, Hynix selected Mattson’s advanced RTP and strip systems for its new 300 mm fab based on their demonstrated superior productivity and cost-of-ownership advantages,” said Randy Y. Matsuda, vice president and general manager of the Films/Etch Products Group for Mattson Technology. “This win demonstrates the confidence that Hynix, a world-class semiconductor manufacturer, places in our systems’ ability to meet its 300 mm DRAM volume production needs. Mattson Technology already has a substantial installed base of 200 mm systems at Hynix, and we are very pleased to now participate in our customer’s 300 mm manufacturing expansion plans.”

About the Helios RTP System

Mattson Technology’s new Helios 300 mm RTP system features an advanced model-based temperature control approach for excellent uniformity, fast ramp and cool-down rates, closed-loop control down to 250°C and dual-side heating for minimized pattern effects. Built on a modular, dual-chamber platform designed for ease of maintenance and high reliability, the Helios includes a dual-arm robot for increased throughput (over 120 wafers per hour). The Helios’ high productivity and small footprint offer significant cost-of-ownership advantages, and its excellent processing performance allows it to address the most demanding RTP applications, including nickel silicide formation and ultra-shallow junction spike anneals, for 90 nm and 65 nm device development and production.

About the Aspen III ICPHT

Built upon the production-proven Aspen platform, Mattson Technology’s new Aspen III ICPHT utilizes an advanced RF plasma source and Mattson’s proprietary inductively coupled plasma (ICP) technology to provide a wider process window for FEOL and BEOL strip applications. Featuring high-speed dual-wafer handling and a modular, dual-chamber design, the system provides excellent within-chamber and module-to-module repeatability. Enhanced features include an upgraded RF assembly and a redesigned heater block for increased strip rates, throughput, performance (throughput and process time improvements of 100% have been demonstrated for HDIS) and reliability. The ICPHT’s high productivity and excellent process performance provide the low CoO required for cost-effective chip manufacturing.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company’s dry strip and RTP equipment utilize innovative technology to deliver advanced processing capabilities on high-productivity platforms for the fabrication of current- and next-generation devices. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.