MATTSON TECHNOLOGY SHIPS MULTIPLE STRIP SYSTEMS TO MAJOR NORTH AMERICAN SEMICONDUCTOR MANUFACTURER

Aspen III Strip and Highlands Systems to Support Chipmaker’s 90 nm Ramp and 65 nm Production Development

FREMONT, Calif.- September 8, 2004 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has delivered and is installing multiple Aspen III Strip and Aspen III Highlands systems at a leading North American chipmaker. The systems will be used at the manufacturer’s fabs to produce 90 nanometer (nm) and develop advanced 65 nm devices.

“The repeat order from one of the world’s largest semiconductor chipmakers underscores Mattson’s strip leadership and the high reliability and process flexibility of our systems for a wide range of front- and back-end-of-line applications,” said Randy Y. Matsuda, vice president and general manager of Mattson Technology’s Films-Etch Product Group. “Mattson’s best-of-breed strip technology will continue to provide the superior high productivity performance and cost advantages needed to help meet our customer’s aggressive 90 nanometer manufacturing ramps and 65 nanometer production development.”

"We’ve built a solid relationship with this customer over many years based on the strength of our strip technology and focus on customer support,” said Douglas K. Walker, director of U.S. Operations for Mattson Technology. “Our long-standing customer again selected Mattson Technology as a key supplier for its fab ramp because of our proven track record of consistently delivering technologically superior process equipment with exceptional productivity, cost of ownership and support.”

About the Aspen III Highlands & the Aspen III Strip

Both the Aspen III Strip and the Aspen III Highlands feature Mattson’s proprietary inductively coupled plasma (ICP) source technology for optimal uniformity and are designed to meet the rigors of high-volume manufacturing in the 300 mm wafer/100 nm and below device era. The Aspen III Highlands is an advanced 300 mm system used for removing resist, residue and barrier layer for low-k/copper applications. The Aspen III Strip system achieves excellent results for high-dose implant strip, photoresist and residue removal and surface cleaning for advanced applications, including low-k and oxygen and non-oxygen-based processes.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company’s dry strip and RTP equipment utilize innovative technology to deliver advanced processing capabilities on high-productivity platforms for the fabrication of current- and next-generation devices. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.