MAJOR JAPANESE CHIPMAKER SELECTS MATTSON TECHNOLOGY STRIP TOOL FOR 65 NM SYSTEM-ON-CHIP VOLUME PRODUCTION

Aspen III ICPHT Tool of Choice at 300 mm Wafer Logic Fab

FREMONT, Calif.- December 1, 2004 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that a major Japanese chipmaker has selected the Aspen III ICPHT strip system for volume production of next-generation logic devices. The first tools from this order have recently been installed at the customer’s new
300 millimeter (mm) fab in Japan, where they join other Aspen III ICPHT tools installed earlier this year.

Mattson’s high-throughput strip systems will be used to support system-on-chip (SoC) and copper interconnect technologies for 65 nanometer (nm) devices on 300 mm wafers. SoC technology integrates multiple operations, such as logic and memory functions, on a single chip to decrease the size and power requirements of the device and increase speed.

“Our customer chose the Aspen III ICPHT for both 65 nm process development and mass production based on its unparalleled reliability and superior performance in front-end-of-line dry strip processing, and for its ability to perform on advanced copper and low-k applications,” said Randy Y. Matsuda, vice president and general manager of the Films/Etch Products Group for Mattson Technology. “The selection from one of Japan’s leading semiconductor manufacturers validates the system’s technical advantages and excellent process capabilities and underscores Mattson’s growing 300 mm strip technology and market leadership.”

“The latest order expands this chipmaker’s installed base of Mattson strip tools and demonstrates the rapid adoption of Mattson’s new high-throughput strip system,” said Mike Y. Morita, director of Global Business Operations of Mattson Technology. “The selection of the Aspen III ICPHT is a testimony to the trust and confidence our customer places in Mattson to meet its processing and support requirements through the 65 nm technology node.”

About the Aspen III ICPHT

Built upon the production-proven Aspen III platform, Mattson Technology’s new Aspen III ICPHT utilizes an enhanced RF plasma source with Mattson’s proprietary inductively coupled plasma (ICP) technology to provide a wider process window for FEOL and BEOL strip applications. Featuring high-speed, dual-wafer handling and a modular design, the system provides the excellent process performance, increased throughput, high reliability and low CoO required for cost-effective chip manufacturing.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company’s dry strip and RTP equipment utilize innovative technology to deliver advanced processing capabilities on high-productivity platforms for the fabrication of current- and next-generation devices. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.