MATTSON TECHNOLOGY’S STRIP AND RTP SYSTEMS WIN COMPETITIVE EVALUATIONS AT GLOBAL SEMICONDUCTOR MANUFACTURER

Aspen III ICPHT and Helios Used for Advanced Memory Device Production at Chipmaker’s First US 300 mm Fab

FREMONT, Calif.- December 14, 2004 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced a major competitive win for its Aspen III ICPHT strip and Helios RTP systems. Following head-to-head competitive evaluations, Mattson’s advanced strip and RTP tools were selected by a global semiconductor manufacturer for its first 300 millimeter (mm) fab in the U.S. The systems, the first of which has begun shipment, will be used for volume-production of the chipmaker’s most advanced memory products, including chips used in personal computers, computer servers and other electronic devices.

“The choice of our 300 mm Aspen III ICPHT strip and Helios RTP systems is the latest example of the competitive wins Mattson is achieving by delivering products and processes with advanced technology, high reliability and excellent productivity,” said Robert B. MacKnight, chief operating officer for Mattson Technology. “These advantages will enable our customer to ramp its production quickly to meet the increased demand for sub-100 nanometer devices.”

"Because of Mattson’s excellent service and support, we have developed a long, strategic partnership with this chipmaker and have a large installed base of systems in both its 200 mm and 300 mm facilities,” said Douglas K. Walker, director of U.S. Operations for Mattson Technology. “We look forward to expanding our synergistic relationship to help this leading chipmaker, one of Europe’s largest semiconductor companies, bring its U.S. 300 mm capacity quickly on line to meet the increasing demand for its advanced products.”

About the Aspen III ICPHT

Built upon the production-proven Aspen III platform, Mattson Technology’s new Aspen III ICPHT utilizes an enhanced RF plasma source with Mattson’s proprietary inductively coupled plasma (ICP) technology to provide a wider process window for FEOL and BEOL strip applications. Featuring high-speed, dual-wafer handling and a modular design, the system provides the excellent process performance, high reliability, increased throughput and low cost of ownership (CoO) required for cost-effective chip manufacturing.

About the Helios RTP System

Mattson Technology’s new Helios 300 mm RTP system features an advanced model-based temperature control approach for excellent uniformity, fast ramp and cool-down rates and closed-loop control down to 250°C. The Helios is built on a modular, dual-chamber platform designed for ease of maintenance, high reliability and throughput of over 120 wafers per hour. The system’s high productivity and small footprint offer cost-of-ownership advantages, and its processing performance addresses the most demanding RTP applications, including nickel silicide formation and ultra-shallow junction spike anneals.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company’s dry strip and RTP equipment utilize innovative technology to deliver advanced processing capabilities on high-productivity platforms for the fabrication of current- and next-generation devices. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.