HYNIX SEMICONDUCTOR ORDERS ADDITIONAL SUITE OF MATTSON TECHNOLOGY SYSTEMS FOR NEW 300 MM FAB

FREMONT, Calif.- January 5, 2005 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced announced follow-on orders for a suite of equipment from Hynix Semiconductor, Inc. for the expansion of its T1 300 millimeter (mm) fab in Ichon, Korea. The multi-system order includes a series of Aspen III ICPHT strip and Helios RTP systems. The suite of 300 mm tools will be used in front- and back-end-of-line applications to produce advanced DRAM (Dynamic Random Access Memory), SDRAM (Synchronous DRAM), flash memory and system IC devices. System shipments are scheduled to begin this month.

“Hynix is an industry leader in the development of high-quality semiconductors, and it is expanding its business with leading 300 mm technology,” said Randy Y. Matsuda, vice president and general manager of the Films/Etch Products Group for Mattson Technology. “Mattson's strip and RTP systems deliver the advanced process capabilities, excellent reliability and high productivity that our customers demand of their products.”

“We believe that our systems' high quality, low cost of ownership and high degree of flexibility, combined with Mattson's excellent service and support, will help Hynix successfully meet its aggressive production ramps,” said J.W. Kim, Korea country manager of Mattson Technology. “We look forward to working with Hynix to help it quickly bring its most advanced devices to the global semiconductor market.”

About the Aspen III ICPHT

Built upon the production-proven Aspen III platform, Mattson Technology's new Aspen III ICPHT utilizes an enhanced RF plasma source with Mattson's proprietary inductively coupled plasma (ICP) technology to provide a wider process window for FEOL and BEOL strip applications. Featuring high-speed, dual-wafer handling and a modular design, the system provides the excellent process performance, high reliability, increased throughput and low cost of ownership (CoO) required for cost-effective chip manufacturing.

About the Helios RTP System

Mattson Technology's new Helios 300 mm RTP system features an advanced model-based temperature control approach for excellent uniformity, fast ramp and cool-down rates and closed-loop control down to 250°C. The Helios is built on a modular, dual-chamber platform designed for ease of maintenance, high reliability and throughput of over 120 wafers per hour, offering clear cost-of-ownership advantages. The system's high productivity and processing performance address the most demanding RTP applications, including nickel silicide formation and ultra-shallow junction spike anneals .

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company’s dry strip and RTP equipment utilize innovative technology to deliver advanced processing capabilities on high-productivity platforms for the fabrication of current- and next-generation devices. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.