LEADING TAIWANESE DRAM CHIPMAKER CHOOSES MATTSON TECHNOLOGY'S HELIOS RTP SYSTEM FOR NEW 300 MM FAB

FREMONT, Calif.- February 8, 2005 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has received orders for its Helios RTP system from a leading memory manufacturer's recently constructed 300 mm fab in Hsin Chu, Taiwan. The Helios systems, which are scheduled to begin shipment in the first half of 2005, will be used at this chipmaker's new fab to manufacture sub-100 nm devices, including SDRAMs (synchronous dynamic random access memory) and DDR (double data rate) SDRAMs.

“Important requirements in selecting equipment for a new 300 mm facility include advanced technology, high productivity and excellent reliability,” said Andreas Toennis, vice president and co-general manager of the Thermal Products Group for Mattson Technology. “Mattson's Helios RTP system meets these criteria, and its exceptional technical performance and cost of ownership should help our customer optimize productivity and achieve volume production quickly in its new 300 mm fab.”

“Our customer, one of Taiwan's largest DRAM manufacturers, selected Mattson's Helios 300 mm RTP system because of its ability to meet the technology and throughput requirements for the manufacture of advanced chips,” said Ming Kao, Taiwan country manager for Mattson Technology. “We are pleased to work with this leading chipmaker to help it meet critical market windows and commercialize its latest-generation products.”

About the Helios RTP System

Mattson Technology's new Helios 300 mm RTP system features an advanced model-based temperature control approach for excellent uniformity, fast ramp and cool-down rates and closed-loop control down to 250°C. The Helios is built on a modular, dual-chamber platform designed for ease of maintenance, high reliability and throughput of over 120 wafers per hour, offering clear cost-of-ownership advantages. The system's high productivity and processing performance address the most demanding RTP applications, including nickel silicide formation and ultra-shallow junction spike anneals.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company’s dry strip and RTP equipment utilize innovative technology to deliver advanced processing capabilities on high-productivity platforms for the fabrication of current- and next-generation devices. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.