| MATTSON TECHNOLOGY SHIPS MULTIPLE RTP SYSTEMS TO LEADING EUROPEAN DRAM MANUFACTURER
Helios Processing Performance and Strong Customer Support Make Mattson Vendor of Choice FREMONT, Calif.-
May 18, 2005 -
Mattson Technology, Inc.
(NASDAQ: MTSN), a leading supplier of advanced process
equipment used to manufacture semiconductors, today announced
that
it has shipped multiple Helios™ RTP systems to a leading European chipmaker. Tool installations are scheduled to begin this month at the customer's state-of-the-art 300 mm fab, where the systems will be used for 90 nm production of advanced DRAM devices. The sale complements the suite of 200 and 300 mm Mattson RTP systems already installed at this chipmaker's facilities around the world.
“The Helios was chosen because it offers our customer the processing flexibility and wide RTP application portfolio required to produce advanced device structures at the 90 nanometer node and below at the lowest cost of ownership,” said Juergen H. Biangardi, vice president and co-general manager of the Thermal Products Group at Mattson Technology. “With production-proven reliability and superior process control, the Helios has demonstrated itself as the RTP tool of choice for all RTP applications at our customer's 300 mm facilities.”
“We've built a solid relationship with this leading semiconductor manufacturer over the last decade based on our comprehensive global support programs,” said John J. Maver, managing director of Mattson Technology's Global Business Operations. “We plan to strengthen this long-standing partnership and our position as RTP vendor of choice by delivering the products and processes our customer needs to ramp 300 mm production of its most advanced memory devices.”
About
the Helios RTP System
Mattson Technology's Helios 300 mm RTP system features an advanced model-based temperature control approach for excellent uniformity, fast ramp and cool-down rates and closed-loop control down to 250°C. The Helios is built on a modular, dual-chamber platform designed for ease of maintenance, high reliability and throughput of over 120 wafers per hour, offering clear cost-of-ownership advantages. The system's high productivity and processing performance address the most demanding RTP applications, including nickel silicide formation and ultra-shallow junction spike anneals.
About
Mattson Technology, Inc.
Mattson Technology, Inc. is the leading supplier of dry strip equipment and the second largest supplier of rapid thermal processing equipment in the global semiconductor industry. The company's strip and RTP equipment utilize innovative technology to deliver advanced processing performance and productivity gains to semiconductor manufacturers worldwide for the fabrication of current- and next-generation devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.
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