MATTSON TECHNOLOGY EQUIPS WINBOND'S NEW 300 MM FAB

FREMONT, Calif.- August 23, 2005 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has installed multiple Helios RTP and Aspen III ICPHT and Strip systems at Winbond Electronics Corporation's new 300 mm fab in Central Taiwan Science Park in Taichung, Taiwan. The systems will be used to produce DRAMs, mobile RAM and flash memory products at the 110 nm node, with extendibility to 90 nm and beyond.

“We selected Mattson's strip and RTP systems based on their excellent processing performance, reliability, technology extendibility and cost-of-ownership,” said Dr. Victor Wang, Winbond's 300 mm fab director. “We believe that Mattson's advanced technology and world-class support will play a critical role in helping us ramp our 300 mm fab to mass production.”

“Winbond's selection validates its confidence in our technology expertise to deliver high-performance, low cost-of-ownership strip and RTP systems that will enable it to achieve volume production success through several device generations,” said Ming C. Kao, Mattson Technology's Taiwan country manager. “We are looking forward to strengthening our market-leading position in Taiwan by providing our customer the leading-edge, scalable systems required to meet its aggressive production goals down through the 90 nm node.”

About Winbond

Winbond Electronics Corporation was founded in Hsinchu Science-Based Industrial Park, Taiwan in 1987. By positioning itself as a “Mobile Electronics Solution” provider, Winbond owns two business groups—Logic IC Business Group and Memory IC Business Group. Logic IC Business Group focuses on three specific domains: microcontroller-based ICs, PC & peripherals and network access ICs. As to Memory IC Business Group, the products include Specialty DRAM, Pseudo SRAM and Flash. Further information is available at: http://www.winbond.com.

About Mattson Technology, Inc.

Mattson Technology, Inc. is the leading supplier of dry strip equipment and the second largest supplier of rapid thermal processing equipment in the global semiconductor industry. The company's strip and RTP equipment utilize innovative technology to deliver advanced processing performance and productivity gains to semiconductor manufacturers worldwide for the fabrication of current- and next-generation devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.