LEADING KOREAN MEMORY MANUFACTURER ORDERS SUITE OF MATTSON TECHNOLOGY SYSTEMS FOR ITS NEW 300 MM FAB IN CHINA

FREMONT, Calif. - July 12, 2006 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced orders for a suite of equipment from a major Korean memory manufacturer for its new 300 millimeter (mm) fab in China. The multi-system orders include a series of Aspen III ICPHT strip, Aspen III LiteEtch and Helios RTP systems, which will be used in front- and back-end-of-line applications to produce advanced DRAM (dynamic random access memory), SDRAM (synchronous DRAM) and flash memory devices at 90 nanometers (nm) and below. System shipments have already begun and are scheduled through the third quarter of this year. The sale complements the large spectrum of 200 mm and 300 mm Mattson systems already installed at this chipmaker’s fabs around the world.

“We are very pleased by the continuous trust in Mattson products shown by this leading memory manufacturer, who has again selected our systems for the process of record (POR),” said Stephen T. Lanza, Global Business Operations vice president and general manager for Mattson Technology. “This latest success further strengthens our leading position in the memory market and supports our expansion in this growing region.”

“Our systems’ on-wafer results, low cost-of-ownership (COO) and high reliability, combined with Mattson’s excellent service and support, will enable this customer to successfully meet its aggressive production ramps and transition to the 65 nm node to quickly bring its most advanced devices to the global semiconductor market,” concluded Lanza.

Featuring Mattson's proprietary inductively coupled plasma (ICP) source technology, the Aspen III ICPHT provides increased throughput, improved process performance and reliability for front-end-of-line and back-end-of-line strip applications.

The Aspen III LiteEtch with its ICP source offers superior process technology and exceptional COO. The system along with Mattson’s recent low-aspect-ratio reactive ion etch (LARRIE) developments provide an alternative to conventional etch applications for advanced device manufacturers.

The Helios addresses the most demanding RTP applications, including nickel silicide formation and ultra-shallow junction spike anneals, enabled by advanced model-based temperature control for high productivity, excellent processing performance and superior COO.

About Mattson Technology, Inc.

Mattson Technology, Inc. is the leading supplier of dry strip equipment and the second largest supplier of rapid thermal processing equipment in the global semiconductor industry. The company's strip and RTP equipment utilize innovative technology to deliver advanced processing performance and productivity gains to semiconductor manufacturers worldwide for the fabrication of current- and next-generation devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.