Mattson Technology’s vision
is to become a premier supplier of capital equipment to the
integrated circuit (IC) industry by delivering innovative
process solutions to our customers. To achieve this goal,
we have developed highly focused product offering and highly
specific technical expertise in RTP and strip technologies.
Creating
solutions to improve the IC fabrication process requires
a combination of exacting science, expert engineering
and innovative design. Process steps for IC fabrication are
designed and measured on a molecular level, making each step
of the wafer fabrication process crucial. The selection of
a wafer fab solution is made by scientific and empirical
analysis at the wafer level: “It’s the precision
or result on the wafer that counts.”
We continue to focus on advancing strip and RTP technology
in the leading-edge transitions to 300 mm silicon wafers
and the 90 nm technology node and beyond. In Strip, we began
full production of our Aspen III Highlands low-k/Cu Strip
solution. The Highlands tool, with our patented inductively
coupled plasma technology, reduces processing steps, eliminates
chemical residues and copper oxidation and preserves the
integrity of low-k materials. The Highlands strip solution
has been installed and accepted in the world’s most
advanced low-k/Cu manufacturing lines.
In RTP, our patented dual-sided lamp technology achieves
superior temperature control and temperature measurement,
minimizes process variations and reduces defects. We also
introduced further innovations in temperature measurement
and control with our 3000 Plus advanced RTP solution. Mattson’s
RTP solutions produce the most consistent results measured
on a deep sub-micron level on the wafer. This precise consistency
is essential in enabling our customers to produce future
generations of smaller and smaller transistors.
Through our process expertise in RTP and strip,
we will continue to deliver proven results on the wafer and
provide true value to our customers.
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