The move to smaller geometries requires that photoresist
stripping achieve complete residue removal with no damage
to thin gate oxides. This has become a key process issue
in photoresist strip, which is used in as many as 25
steps during IC production.
Mattson Technology is the
premier strip provider in the foundry market and the
bulk and 300 mm strip market leader.
Our strip systems offer the widest process range and feature
our patented inductively coupled plasma (ICP) technology
for uniform wafer heating. Mattson’s strip technology
provides lower contamination and higher wafer throughput
than conventional photoresist strip processing. Complete
residue removal is accomplished in one chamber in situ, eliminating
the need for organic solvents, thereby reducing process costs
and alleviating environmental concerns. Mattson’s strip
systems offer our customers the lowest total cost of ownership
(TCO) by providing the highest yield, fastest throughput,
reduced strip steps and lowest operating cost.
 |
|
 |
| Aspen III eHighlands |
Aspen III Highlands |
Aspen III ICPHT |
|
