The latest addition to Mattson's complete family of dry strip products, the Alpine™ enables chipmakers to handle copper/low-k dielectric integration, low-k/ ultra low-k ashing, resist recess, barrier layer removal and other BEOL dry strip challenges with a single tool, in addition to all critical FEOL dry strip process requirements. With a low-pressure regime, the Alpine provides improved profile control, low-k material preservation and a wider process window. The system builds on Mattson’s latest production proven platform and is designed for reliable, high-productivity, low-cost-of-ownership manufacturing for 65 nm and below.
The Alpine features Mattson's proprietary inductively coupled plasma (ICP) source and a bias capability that enables independent control of ion energy and ion density at low pressures to minimize damage to low-k materials for sub-65 nm processing. The Alpine's unique PR processing for low-k/Cu dual damascene structures for advanced logic devices, provides chipmakers up to 35% lower cost-of-ownership than dielectric etch tools.
Alpine’s innovative proprietary platform is based on a flexible, modular design that makes it ideal for both development and production environments. The system features reliable, high-speed vacuum and atmospheric robotics that deliver increased throughput and over 40% improvement compared to competitive systems for advanced strip applications. Its vacuum robot utilizes an innovative transfer mechanism; capable of transferring four wafers simultaneously, to minimize overhead time. With a compact footprint for highest space efficiency, Alpine is configured with two dual-wafer modules.
|
