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Aspen III eHighlands |
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The latest addition to Mattson's complete family of dry strip products, the Aspen III eHighlands meets all critical FEOL dry strip process requirements and enables chipmakers to handle copper/low-k dielectric integration, ultra low-k ashing, barrier layer removal and other BEOL dry strip challenges with a single tool. With a low-pressure regime, the eHighlands provides improved profile control, low-k material preservation and a wider process window. Available in 200 mm and 300 mm versions, the system builds on the production-proven Aspen III Highlands and is designed for reliable, high-productivity, low-cost-of-ownership manufacturing for 90 nm and below.
The eHighlands features Mattson's proprietary inductively coupled plasma (ICP) source and a bias capability that enables independent control of ion energy and ion density at low pressures to minimize damage to low-k materials for sub-90 nm processing. The eHighlands' unique “three-in-one” integration scheme, where the low-k strip, barrier removal and Cu surface treatment processes are performed in-situ, provides chipmakers up to 35% lower cost-of-ownership than dielectric etch tools, which use an “all-in-one” approach.
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