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Aspen III Highlands |
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The Aspen III Highlands is an advanced 300 mm
system used for removing resist, residue and barrier layer
for low-k/copper applications. Built on Mattson's production-proven,
high-throughput Aspen III platform, the Highlands features
a proprietary ICP technology for optimal uniformity and low
damage. The system's modular design allows process modules
to be added for greater production capacity and process flexibility.
The Highlands' dual-wafer processing capability provides the
industry's leading productivity—virtually twice the throughput
of competitive low-k capable systems. The Highlands' ability
to reduce operational steps simplifies integration and provides
customers unparalleled total cost of ownership (TCO).
The new system provides advanced processing recipes that enable
interconnect technology for 90 nm and smaller geometries using
a wide range of hydrogen and fluorine chemistries. This feature
enables manufacturers to clean vias or trenches with exposed
low-k materials while maintaining low-k film integrity and
enables effective cleaning of copper films.
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