The latest addition to Mattson's complete
family of BEOL and FEOL strip products, Suprema utilizes
a new and revolutionary
platform design to deliver superior
productivity and reliability with exceptionally low cost of ownership for manufacturing
at the 90 nm node and below. The system’s enhanced RF plasma source, based
on Mattson’s field-proven, proprietary inductively coupled plasma (ICP)
technology, enables very high strip rates and its innovative wafer transfer mechanism
provides the highest throughput in the industry. Suprema provides excellent within-chamber
and chamber-to-chamber process repeatability and offers a wide process window
for both FEOL and BEOL applications, including bulk photoresist strip, high-dose
implant strip (HDIS), descum and resist recess.
Suprema’s innovative proprietary
platform is based on a flexible, modular design that makes
it ideal for both development and production environments.
The system features reliable, high-speed vacuum and atmospheric
robotics that deliver increased throughput of greater than
300 wafers per hour and over 40% improvement compared to competitive
systems for bulk strip applications. Suprema’s proprietary
inductively coupled plasma (ICP) source provides increased
strip rates of over 9 µ/minute. Its vacuum robot utilizes
an innovative transfer mechanism, capable of transferring
four wafers simultaneously, to minimize overhead time. With
a compact
footprint for highest space efficiency, Suprema can be configured
with two dual-wafer modules.
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