Dry strip is the removal of the masking layers from the wafer after the patterning process has been completed. The objective is to eliminate the masking material from the wafer as quickly as possible, without allowing any surface materials to become damaged.
We are a leader in the dry strip market. Our strip systems offer innovative wafer handling architecture to deliver low cost of ownership for integrated circuit manufacturing.
SUPREMA® product family
Our SUPREMA family plasma dry strip systems have unique ICP source and twin-wafer chamber design, with leading-edge process capability and wide process window. Each chamber is operated independently with a dedicated vacuum transfer module for maximum process flexibility and best process performance.
The SUPREMA family plasma dry strip systems provide high productivity with low particle/contamination performance in addition to low cost of ownership in volume production. They are tools of choice for photoresist removal in major Logic/Foundry and Memory fabs worldwide.