Dry Strip

Dry strip is the removal of the masking layers from the wafer after the patterning process has been completed. The objective is to eliminate the masking material from the wafer as quickly as possible, without allowing any surface materials to become damaged.

We are a leader in the dry strip market. Our strip systems offer innovative wafer handling architecture to deliver low cost of ownership for integrated circuit manufacturing.

 

SUPREMA® product family

Our SUPREMA family plasma dry strip systems have unique ICP source and twin-wafer chamber design, with leading-edge process capability and wide process window. Each chamber is operated independently with a dedicated vacuum transfer module for maximum process flexibility and best process performance.

The SUPREMA family plasma dry strip systems provide high productivity with low particle/contamination performance in addition to low cost of ownership in volume production. They are tools of choice for photoresist removal in major Logic/Foundry and Memory fabs worldwide.

Product Features and Advantages:

  • Remote Inductively Coupled Plasma (ICP)
    • Patent protected grounded Faraday shield design
      • High plasma density
      • Extraordinary reducing chemistry capability
      • Low particle performance
      • High mean-time-between-clean
      • Low consumable cost
      • Unique high fluorine process capability
    • Over 10,000 units installed worldwide
  • Twin-Wafer Chamber Design
    • Complete ion filtering capability
      • Low wafer surface plasma damage
      • Good surface integrity
    • Precise wafer temperature control
    • Full spectrum OES end point detection option
  • Platform
    • Multi-chamber design with independent vacuum transfer module
      • Process flexibility
      • Process extendability
      • Process stability
    • Quad arm robot design, high throughput wafer transfer
    • Over 700 installed worldwide

Applications:

  • Logic / Foundry, Memory Manufacturing
    • Bulk strip
    • Post-implant strip
    • Strip over metal
    • Post etch strip / clean
    • High aspect ratio strip / clean
    • Descum
  • COMS Image Sensor / MEMS / Power Device Manufacturing
    • Bulk strip
    • Descum
    • Surface clean
  • Wafer Level Packaging
    • Dry film resist ash
    • Descum
    • Surface clean