We are a key supplier of plasma and rapid thermal processing equipment to the global semiconductor industry. Our processing equipment utilizes innovative technologies to deliver advanced processing capabilities and high productivity for the fabrication of current and next-generation integrated circuits. Our equipment and technologies are used by leading memory, foundry and logic device manufacturers, worldwide.
We maintain our global headquarters in Fremont, California, with design and manufacturing centers in the United States and Germany. We also maintain a global sales and support organization focused on developing strong, long-term customer relationships. Our global customer support organization is headquartered in California, with sales and support teams located in China, France, Germany, Japan, Korea, Singapore, Taiwan and the United States.
Mattson Technology was founded in 1988 in Fremont, California. After breaking into the semiconductor equipment industry as a leading supplier of dry strip equipment, we expanded our portfolio of processing equipment to also include plasma etch, rapid thermal anneal and millisecond anneal. In addition to our product portfolio, we have also grown an extensive portfolio of intellectual property including key technologies under worldwide patents. In May 2016, Mattson Technology was acquired by Beijing’s E-Town Capital. Our new investor’s vision is that Mattson Technology, with its Silicon Valley DNA, will continue to operate as a global, market-driven technology provider serving the worldwide semiconductor manufacturing customers.
As we approach our 30th anniversary, we continue to be fully committed to developing process equipment and technologies to address our customers’ evolving needs for high productivity solutions for the consumer-driven electronics market. Our focus on delivering “on-wafer results” is fundamental to our philosophy of providing increasing value to our customers. We continually strive to increase the total value of our solutions by enabling our customers to cost-effectively produce next-generation chips with ever-greater density and functionality.